Sealed, 1" pitch, high performance dry-air 3U chassis incorporates four heat exchangers, heat pipes and air re-circulation fans inside. This conventional format chassis is ideal for applications where ambient air is laden with hostile or harmful contaminants.
Heat generated within the enclosure is conducted to the hollow sidewalls, top cover & rear panel heat exchanger where it is dissipated to the ambient environment by forced air rear fans or by vehicle platform air plenum. Integrated heat pipes provide fast passage for heat to exit the internal card-cage. Internal air recirculation fans ensure constant airflow across modules.
The 3U HES-FBL-HP chassis is available in 3, 5, 7 & 9 slot versions, supporting VPX & cPCI-S backplanes. A total PSU power of up to 825 watts may be installed. Custom modifications can be designed upon customer request.
Internal layout is divided into 4 independent metallic partitions. I/O section at the front, card-cage, PSU section & exhaust fans at the rear. This improves EMI/EMC performance & reduces PSU noise on system electronics.
Conventional "front-to-back" configuration allows for convenient appication upgrade and expansion, keeping the same PSU, Front Panel and Fan Packs across systems. The chassis card-cage is designed for wedgelock IEEE P1101.2 conduction-cooled card types.
Slots / Pitch:3 | 5 | 7 | 9 1"
Sealed (Dry Air):≤ 500W
The 3U HES-FBL-HP chassis is suitable for high wattage sealed applications that demand superior cooling capability and increased life-cycle scalability. This series of chassis provides the greatest expansion felxibility, system interoperability and lowest upgrade costs for advancing platforms.
HES-FBL-HP - Chassis Payload Thermal Resistance (CPTR):
HES-FBL-HP 3 Slot: 320W Payload Power (ΔT/W = 0.09°C).
HES-FBL-HP 5 Slot: 400W Payload Power (ΔT/W = 0.075°C).
HES-FBL-HP 7 Slot: 450W Payload Power (ΔT/W = 0.066°C)..
HES-FBL-HP 9 Slot: 500W Payload Power (ΔT/W = 0.060°C)..
For reliable operation it is recommended the maximum Payload Power not be exceeded. Subject to operating conditions. All CM 3U ATR chassis are delivered tested, qualified and certified per Military Standards MIL-STD-461E & MIL-STD-810F.
CM 3U backplanes are low noise, full military VMEbus, VPX or cPCI-S compatible and provide fully standard bus slot & signal daisy-chain functionalities. Bus slots are tailored for 1 inch pitch standard & deliver full compatibility with 0.8 inch pitch 3U modules.
CM 3U enclosures incorporate a versatile universal ‘MCS’ slot mixed card-cage that accepts all off-the-shelf Conduction Cooled and Air Cooled 3U modules.
An alternative ‘CCS’ conduction cooled card-cage is available for conduction-cooled boards only, whereby improving thermal performance.
All 3U backplanes install specific TTL logic circuitry for driving up to 8 front panel user LED indicators.
All 3U backplanes integrate a Temperature Supervisory Unit (TSU) with panel LED (over/under temperature) that controls Power Supply & Fan operation. Remote optoisolated control switches for ‘Battle-short’ & chassis PSU ‘on/standby’ are fitted as standard.
CM 3U military backplanes allow unlimited pin I/O wiring capability. Flexible top & bottom wiring integration is facilitated by a standard 25mm bottom cavity clearance.
Class 1 military power input connectors fitted on the backplane offer shock & vibration reliability interconnectivity between chassis internal modules & allows high DC current rates with low voltage drops and minimum contact heating.
3U backplanes are supplied with military conformal coating. Printed circuits boards are partially coated per MIL-I-4658C. This is carried out only in areas in which coating the product does not affect VPX, VME, cPCI or I/O connectors.
All 3U models integrate the same backplane electronics for easy switch-overs, retrofits or replacement parts.
3U HES-FBL-HP chassis PSUs support a wide variety of AC/DC input voltages (MIL-STD-704 & MIL-STD-1275) and customer defined DC power output combinations up to Watts. Available in 6 different versions (A-B-C-...) to suit the demand per DC Line of standard COTS open busses.
All PSU models are fitted with Power Fail Monitor, remote voltage sensing, output voltage trim-up, time-delayed protection fuses, rear fan fuse and DC/DC converter remote shutdown.
To comply with MIL-STD-461G, a high capacity integrated EMI/EMC input voltage filter is fitted as standard on all 3U models. All models integrate the same PSU and backplane electronics.
Single-phase AC PSUs are fitted with a VICOR military Filter and Autoranging Rectifier Module (FARM) to provided EMI filtering, autoranging line rectification and inrush current limiting to meet MIL-STD-461E category A1b specifications for Electromagnetic Compatibility.
200VAC 3-Phase PSU versions additionally incorporate AC/DC rectifier stage prior to the VICOR FIAM front-end modules.
DC PSUs are equipped with a VICOR military Filter and Attenuator Module (FIAM). This front-end device is fitted prior to the DC/DC converters to provide EMI filtering, inrush current limiting and transient protection.
Front-end FIAM modules are protected against DC reverse polarity. An optional reverse polarity diode may be fitted in series with power connector input pin IN (+).
3U HES-FBL-HP PSUs incorporate isolated DC/DC converters and oversized hold-up capacitors to ensure proper operation during short power line failures. Outputs are protected against short-circuit, thermal-shutdown etc. PSUs are custom made to match the enclosure mechanics.
The PSU in HES-FBL-HP models is attached to a heat exchanger panel that provides both conduction and convection cooling. Internal air recirculation dissipates heat generated by the PSU through its panel via thermal conduction to the chassis frame.
Forced air that is drawn through the heat exchangers, passing over the PSU panel external fins & exhausted, removing the majority of heat.
|WIDTH||144.2 mm||144.2 mm||144.2 mm||144.2 mm|
|HEIGHT||257.5 mm||257.5 mm||257.5 mm||257.5 mm|
|DEPTH||254.6 mm||305.4 mm||356.2 mm||407 mm|
|WEIGHT||5.2 Kg||6.0 Kg||6.8 Kg||7.7 Kg|
|CPTR COEFF||ΔT/W = 0.09°C||ΔT/W = 0.075°C||ΔT/W = 0.066°C||ΔT/W = 0.060°C|
|HEAT PIPES||4 - ⌀ 8mm||8 - ⌀ 8mm||12 - ⌀ 8mm||16 - ⌀ 8mm|
|MAX PSU PWR||825 Watts (28 VDC 775 Watts)|
|PSU V-INPUT||28 VDC ±30%, 48 VDC ±30%, 72 VDC ±30%, 270 VDC ±30%, Autorange 90-132 VAC RMS & 180-264 VAC RMS 47-880 Hz, 3-Phase 200 VAC ±30% 47-880 Hz|
|STD BACKPLANE||3U (1" Pitch), VPX & cPCI-Serial R.2.0|
|BOARD FORMAT||CCS: Conduction-cooled slots only ANSI-VITA 48.2 boards|
|INTERNAL FAN||1 x 13.5 CFM||2 x 13.5 CFM (27 CFM)||3 x 13.5 CFM (40 CFM)||4 x 13.5 CFM (54 CFM)|
|EXT. REAR FAN||2 Rotron PX2|
|F115-400||130 CFM (Rotron PX2)|
|F200-400||240 CFM (Rotron PX2)|
|FRONT PANEL AREA||96 mm x 158 mm|
|CM FRONT PANEL I/O||6 Power Pins (13 Amp) & 382 I/O Pins (5 Amp)|
|MTBF||25° GB 82,000 Hours, 65° AIC 27,000 Hours|
|OPERATING TEMP||-40°C to +85°C Operating Temperature, -55°C to 100°C Storage Temperature|
These highly optimized 3U chassis incorporate all proprietary technologies, features and well established mechanical & electrical solutions developed during the past 20 years.FAC:Flow-through airflow open enclosure.